Kind 型号 | Performance 性 能 | Application 应 用 |
DK1081 | R:0.18μm,Thickness range:0.4um-0.8μm | AA/Poly/CT |
DK1080 | R:0.25μm,Thickness range:0.55μm-1.0μm | Implant/AA/CT |
DK1088 | R:0.25μm,Thickness range:0.8μm-1.4μm | TV/TM/Implant |
DK1089 | R:0.25μm,Thickness range:0.8μm-1.4μm | TV/TM/Implant |
DK1087 | R:1μm,Thickness range:3-4μm | Special application/ PAD |
DK2060 | R:0.25μm,Thickness:0.55-0.8μm | Contact/Hole |
DK3030 | R:0.25μm,Thickness:0.6-0.8μm | AA/Metal/Contact/Hole |
DKN1100 | Krf Negative PR R:0.20μm,Thickness:0.4-0.8μm | SAB/Implant |
Kind 型号 | Performance 性 能 | Application 应 用 |
C7600 | R:0.30μm,Thickness range:7000A-12000A | 0.3um process |
C7500 | R:0.4μm,Thickness range:7000A-12000A | 0.4μm process |
C7510 | R:0.5μm,Thickness range:19000A-36000A | 0.5um process |
C7310 | R:0.45μm,Thickness:13000A-15000A | 0.5μm process |
C8315 | R:0.65μm,High heat resistance | 0.65μm process |
C8325 | R:0.9μm,Thickness:14000A-23000A | 0.9μm process |
C8350 | R:1.2μm,Thickness:20000A-35000A | Metal/Passivation |
C5315 | R:0.65μm,Thickness:10000A-17000A | 0.65μm process |
EP3200A | R:1.0μm,Thickness:20000-35000A | LED positive resist |
Kind 型号 | Performance 性 能 | Application 应 用 |
C6111A1 | g-i line thick resist,Thickness:30000-50000A | Implant/Passivation |
C6350A | g-i line thick resist,Thickness:40000-80000A | Passivation layer |
C6230 | g-i line thick resist,Thickness:40000-80000A | Implant/Passivation |
C6124A1 | g-i line thick resist,Thickness:<11μm | LED/Packaging |
CP4800/CP4900 | For KOH and TMAH base developer | Packaging/IGBT |
C9005 | ICA PR,R:0.8μm,Thickness:3-8μm | RDL/TSV |
Kind 型号 | Performance 性 能 | Application 应 用 |
EN3120A1 | R:2μm@4μm,Thickness:4.5-9.5μm, High heat resistance | IC/LED |
E3130A | Lift off negative resist,High resolution | IC/LED |
E3260A2/S | R:5μm@8μm,<100mj/cm2,Thickness:6-12μm | IC/LED |
E3502 | R:0.6μm@2.4μm,Thickness:2-4μm,Easy strip | IC/LED |
E3510 | R:6μm@14μm,Thickness:5-20μm,Easy strip | IC/LED |
E3175/B | R:2.0μm@3.8μm,Small undercut,Thickness:2-4μm | IC/LED |
Kind 型号 | Performance 性 能 | Application 应 用 |
BP218 | 通用型正胶 | IC/MEMS |
BP212 | 通用型正胶 | IC/MEMS |
Kind 型号 | Performance 性 能 | Application 应 用 |
BN310 | 高分辨负胶 | 分立器件 |
BN303 | 通用型负胶 | 分立器件 |
BN308 | 高抗蚀负胶 | 分立器件 |